Suruga Seiki Taiwan Branch participated in the UK innovation award ceremony and showcase presentation on 2025/3/19. Suruga Seiki Taiwan wins UK-TW smart manufacturing project on semiconductor and photonics cooperation projects with one of the photonics UK entities. This would influence the long-term partnership between Suruga Seiki and the global photonics industry. (VP Hevin Yu and Sr. Mgr Sayuri Kinoshita is the project execution member.)
2025/2/24 Taiwan HiSPA (Heterogeneously Integrated SiliconPhotonics Alliance) signed MoU with Netherlands PhotonDelta on photonics cooperation. Suruga Seiki Taiwan is a member of HiSPA and President Alex Wu is the co-founder of HiSPA to become Suruga Siliconphotonics business enabler. Looking forward for future collaborations with Netherlands and European ecosystem through this alliance.
Thank you very much for your continued patronage of our products.
We would like to inform you that there will be a change in the country of origin labeling for the following products.
Additionally, for individual processed products such as spacers, the country of origin was indicated using laser marking.
Because the product is intended to be used in combination with a product, we have removed the country of origin label due to concerns that the product's country of origin may be misunderstood.
(Change in country of origin label_detailed information: Yes ⇒ written as no)
Please note that there are no changes to the product specifications, functions, shape, or quality. We appreciate your support, cooperation and understanding to this matter.
■Change reasons
Review of country of origin labeling based on customs notification materials (*)
※Overview of Rules of Origin / Bureau of Customs, Ministry of Finance, EPA Rules of Origin Manual / Bureau of Customs, Ministry of Finance
■Schedule
The change will be made sequentially starting from May 13, 2024.
*Products before and after the change may be mixed due to distribution inventory, etc.
Addressing HPC, CPO, Advanced Package Technologies, Data Center, OFC, 5G, Biosensor, Fiber Optic Gyroscope, and LiDAR applications, SURUGA SEIKI provides the System/Module solutions on Silicon Photonics wafer and chip testing/packaging.
We successfully implement the engineering and mass production equipments to Taiwan and Asia region customers.
We appreciate your access to our website and interest to our products.
Suruga Seiki Japan office will be closed April 29th, 2021 and May 1st - 5th, 2021 due to the consecutive national holidays in Japan.
We apologize for your inconvenience during this period.
All mails and inquiries received during this time will be replied from May 6h, 2021.
We appreciate your access to our home page and interest to our products.
Suruga Seiki Japan office will be closing from the below schedule due to a big national holiday in Japan.
Japan office closing date : 29th Apr. and 2rd ~ 6th May 2020
All mails and inquirires recevied during this time will be replied from 7th May 2020
We appreciate your understanding and cooperation to this matter.
We will be exhibiting at the SPIE Photonics West 2020. New Laser Autocollimator and other new product lineup will be exhibited there.
Please visit our booth and experience the new Suruga Seiki technologies.
We will exhibit at The 29th JAPAN INTERNATIONAL MACHINE TOOL FAIR (JIMTOF 2018) in collaboration with BECKHOFF Automation.
We look forward to seeing you at JIMTOF 2018.
The 29th JAPAN INTERNATIONAL MACHINE TOOL FAIR (JIMTOF2018)
Date:November 1 to 6,2018
Booth Hall:E5035, East 5 hall
Venue:Tokyo Big Site(Tokyo International Exhibition Center)
JIMTOF Official website http://jimtof.org/en/index.html