日商駿河精機是一家提供光機電技術整合與精密對位,先進封裝技術的60年企業,憑藉多年光通訊產業實績並結合光電半導體元件經驗,近年積極切入矽光子高階封測設備與模組,以滿足光量子產業上中下游客戶的產品開發及生產需求。
駿河精機亞太暨台灣區總經理 吳堂榮 受邀擔任國際矽光子異質整合聯盟(HiSPA)成立大會講師,講授矽光子ecosystem架構與供應鏈封裝測試面臨的挑戰。吳總在光機電,半導體硬軟體產業服務多年,其指出台灣矽光子技術現況欠缺的是整合型人才以投入與PIC , 光模塊等先進設計, EIC, PIC異質整合與先進封裝更是矽光子領域的決勝點。目前矽光子已跨入小量生產階段,由於全球領導廠商的積極推動, 晶片設計,晶圓代工,封測廠,ODM整合大廠等大量投入技術資源, 相信在不久將來就可以看到AI, 數據中心, 感測技術,生醫量測等應用的爆炸性成長。
矽光子技術發展需要台灣產官學研之間持續緊密合作, 以彌補現況的不足,日商扮演材料與關鍵零組件技術及軟體演算法,期待結合相關供應鏈夥伴共同投入市場、一起打造矽光子台灣隊,服務全球市場,再創一項兆元產業發展。
日商駿河精機亞太暨台灣區總經理 吳堂榮
2024/4/9 受邀出席擔任國際矽光子異質整合聯盟成立大會講師
Thank you very much for your continued patronage of our products.
We would like to inform you that there will be a change in the country of origin labeling for the following products.
Additionally, for individual processed products such as spacers, the country of origin was indicated using laser marking.
Because the product is intended to be used in combination with a product, we have removed the country of origin label due to concerns that the product's country of origin may be misunderstood.
(Change in country of origin label_detailed information: Yes ⇒ written as no)
Please note that there are no changes to the product specifications, functions, shape, or quality. We appreciate your support, cooperation and understanding to this matter.
■Targeted products/change details
> Download:Change in country of origin labeling_detailed information.pdf
■Change reasons
Review of country of origin labeling based on customs notification materials (*)
※Overview of Rules of Origin / Bureau of Customs, Ministry of Finance, EPA Rules of Origin Manual / Bureau of Customs, Ministry of Finance
■Schedule
The change will be made sequentially starting from May 13, 2024.
*Products before and after the change may be mixed due to distribution inventory, etc.
2023年9月14月, 日商駿河台灣分公司業務經理 Chris 出席PIDA 與光學公會舉辦的光學技術論壇, 會議中 Chris 針對駿河精密光學檢測解決方案應用在「半導體封裝, 矽光子,智能手機與車載鏡頭」等量測技術發表演說,預期以上相關市場在近年皆有重大成長
2023年9月4月, 日商駿河台灣暨亞太區 總經理Alex, 技術長 Hevin, 業務經理 Chris 連袂出席「台荷創新論壇-矽光子合作議題」, 會議中 Alex 與Hevin 針對跨國矽光子晶圓/晶片封測合作發表演說, 並獲得在場來賓熱烈討論及迴響
日商駿河精機亞太暨台灣區總裁吳堂榮受邀擔任筑波科技舉辦的「2023 Optical Communication & Silicon Photonics Workshop」光通訊與矽光研討會的專題演講者。矽光子技術不只應用於光通訊傳輸領域,更廣泛運用在數據中心伺服器、電子與生醫感測應用, EV光達以及次世代AI高性能運算。研討會中,吳總裁深入淺出地分享駿河精機解決方案如何運用其「關鍵零組件, 模組,與整機設備」完整且快速地滿足客戶從研發, 試作到量產的Siliconphotonics 晶圓級封裝測試需求。期待能與台灣夥伴們一同建立國家隊,在全球矽光技術及商業模式上建立產業生態圈ecosystem, 共同為下一個半導體黃金時代盡一份心力。
(近期活動:9月份在台北將有另一場研討會,與來自歐洲的夥伴一同分享矽光產業發展現況)
日商駿河亞太暨台灣區總經理 吳堂榮於 2022/12/6蒞臨「科技部, 日台交流協會, 台科大, TEEIA, PIDA」等單位合辦之 「台日科技對話-半導體關鍵技術佈局與人才育成論壇」。
會中針對「先進矽光子晶片產業趨勢與封測技術」發表專題演講。
因應HPC, CPO(Co-Package Optics)高階封裝技術與數據中心, 光通訊、5G、生物感測晶片、陀螺儀、LiDAR等終端應用市場需求
駿河台灣提供矽光子測試與封裝解決方案,相關設備與模組已成功導入台灣及亞太區客戶
相關需求請洽詢本公司業務窗口:游智閔Chris
郵件:chris.yu@suruga-g.co.jp
Addressing HPC, CPO, Advanced Package Technologies, Data Center, OFC, 5G, Biosensor, Fiber Optic Gyroscope, and LiDAR applications, SURUGA SEIKI provides the System/Module solutions on Silicon Photonics wafer and chip testing/packaging.
We successfully implement the engineering and mass production equipments to Taiwan and Asia region customers.
Please contact us for more information:
SURUGA SEIKI CO., LTD. TAIWAN BRANCH
TEL:+886-22570-1128 ext. 816
Email: ml-twost-maillist@suruga-g.co.jp
Website: https://tw.surugaseiki.com/
We appreciate your access to our website and interest to our products.
Suruga Seiki Japan office will be closed April 29th, 2021 and May 1st - 5th, 2021 due to the consecutive national holidays in Japan.
We apologize for your inconvenience during this period.
All mails and inquiries received during this time will be replied from May 6h, 2021.
駿河精機台灣分公司以及亞太區組織 (SURUGA SEIKI Ltd., Taiwan Branch & APAC Organization)
於2021/2/23正式加入全球知名企業 鴻海集團MIH平台聯盟的會員,
駿河精機將以提供以下解決方案致力於協同合作夥伴開發全球電動車共用平台,
並以尖端獨特的日系工藝技術, 協助台灣企業持續壯大電動車產業版圖。
・提供高精密度汽車電子3D IC 封裝對位設備與關鍵機構零部件
・提供汽車電子ADAS 鏡頭光學檢測, LiDAR光達先進封裝, 光通訊元件耦光等光機電技術整合與檢測方案
・已於2017年在台灣建立技術整合服務中心, 提供完整的全球化產品, 快速的在地化技術支援
■聯繫我們
日商駿河精機股份有限公司台灣分公司
We appreciate your access to our home page and interest to our products.
Suruga Seiki Japan office will be closing from the below schedule due to a big national holiday in Japan.
Japan office closing date : 29th Apr. and 2rd ~ 6th May 2020
All mails and inquirires recevied during this time will be replied from 7th May 2020
We appreciate your understanding and cooperation to this matter.
■Contact us
e-ost@suruga-g.co.jp
We will be exhibiting at the SPIE Photonics West 2020. New Laser Autocollimator and other new product lineup will be exhibited there.
Please visit our booth and experience the new Suruga Seiki technologies.
SPIE Photonics West 2020
Date: February 4 – 6, 2020
Booth: #4186, Hall F0
Venue: The Moscone Center, San Francisco, California, United States0
Official web site: https://spie.org/conferences-and-exhibitions/photonics-west
新年期间各施设将于以下日期暂停营业,请各位确认。
2019年12月28日 ~ 2020年1月5日
We will exhibit at The 29th JAPAN INTERNATIONAL MACHINE TOOL FAIR (JIMTOF 2018) in collaboration with BECKHOFF Automation.
We look forward to seeing you at JIMTOF 2018.
The 29th JAPAN INTERNATIONAL MACHINE TOOL FAIR (JIMTOF2018)
Date:November 1 to 6,2018
Booth Hall:E5035, East 5 hall
Venue:Tokyo Big Site(Tokyo International Exhibition Center)
JIMTOF Official website http://jimtof.org/en/index.html
■Contact us
SURUGA SEIKI Co., LTD. TAIWAN
TEL. +81-3-6403-4513
Email.ml-twost-maillist@suruga-g.co.jp
SURUGA SEIKI website https://tw.surugaseiki.com/
We are holding an exhibition. "HANNOVER MESSE", April 23 - 27, 2018.
Many customers visit our booth.
HANNOVER MESSE
Date: April 23 – 27, 2018
Booth Hall:16, F16, Deutsche Messe
Venue: HANNOVER MESSE
Official web site:http://www.hannovermesse.de/home
Your attendance would be greatly appreciated.
◆For inquiries by e-mail
E-mail:e-ost@suruga-g.co.jp
新年期间各施设将于以下日期暂停营业,请各位确认。
12月29日~1月4日